Gold nanocubic structures agglomeration when put on conductive surfaces - Open Research Data - Bridge of Knowledge

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Gold nanocubic structures agglomeration when put on conductive surfaces

Description

This dataset contains Dynamic EIS results obtained for the gold electrodes with non-functionalized gold nanocubes (AuNC) deposited at its surface. The deposition was the following: 2 uL of the solvent containing CTAB as the surfactant was put on the electrode and dried, the same procedure was applied 5 times. Afterward, the electrode was immersed in the electrolyte. The electrolyte was 0.1 M KCl with 1 mM ferrocyanides as the redox probe. The study show change of the impedance characteristic depending on the AuNC concentration, authors studied: 0, 10, 20, 30, 40 and 50 uL of AuNC. 

The Dynamic Electrochemical Impedance Spectroscopy (DEIS) measurement was carried out simultaneous to cyclic voltammetry (CV) scan in a wide polarization range. The results were obtained using the perturbation composed of the elementary signals with a frequency range between 3 and 24500 Hz. The studies were done using Autolab 302N potentiostat and 20 bit National Instruments measurement card. 

The detailed information about the experimental conditions is given in 51200_51200_test1.txt and tpi.txt files in each subfolder. The first possess the information about the frequencies used (first column, in Hz) and the amplitudes (last column, in V). The second file provides information about the conditions for each measurement: time (in s), potential (in V) and current (in A), respectively. Finally, the third file (zw.txt) provides the information about Z' and Z'' (in Ohms) for each point given in tpi.txt file.

Dataset file

dataset_1.zip
561.4 kB, S3 ETag f50a32d32a1d69a2f1902e03170a25c9-1, downloads: 2
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File details

License:
Restricted access
restricted until published

Details

Year of publication:
2021
Verification date:
2021-08-06
Dataset language:
English
Fields of science:
  • chemical sciences (Natural sciences)
  • materials engineering (Engineering and Technology)
DOI:
DOI ID 10.34808/d914-vp60 open in new tab
Funding:
Series:
Verified by:
Gdańsk University of Technology

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