Every electronic device must be operated below a specified temperature level to warrant its reliability and long-term service life. The upper-temperature level that these devices can survive depends on the types of electronic components used in them. Broadly recommended upper limits of temperatures based on their application are as follows: • commercial applications - up to 70°C, • industrial applications - up to 85°C, • military applications - up to 125°C. The fluid distribution seems crucial in heat sink operation, especially in electronics cooling applications. The uneven velocity profile over the surface causes a non-uniform temperature field, deterioration of heat transfer, and hotspots appearance. While the electronics operation is limited by a junction temperature, after exceeding it even in a single point, thermal throttling (connected with a performance reduction) is applied in the electronic device to prevent permanent damage. Thus, the uniform temperature over the heat sink’s surface is of great importance for the high performance of electronics. Increasing the temperature uniformity while reducing the maximum temperature gives a possibility to increase the microprocessor power until the junction temperature is reached. The project aims to improve the fluid distribution over the micro pin fin heat sink’s (MPFHS) surface in the two-phase flow cooling of electronics by incorporating multiple inlet designs with cyclone generation instincts. Besides the opportunity to reduce the maximum temperature and intensify the heat transfer, the novel designs aim to reduce the pressure drop compared with a conventional single inlet and single outlet design. The project's results will answer the following research questions: • How to dissipate heat from the electronics’ surface and keep a uniform temperature profile during a two-phase flow? • How do the multiple inlet/outlet designs affect the temperature distribution and heat sink’s pressure drop? • Is it possible to increase the heat flux dissipated from the surface by making a temperature profile more uniform and simultaneously reducing the surface’s maximum temperature while reducing the pressure drop? It is planned to publish 5 scientific papers in the international journals. Moreover, the project implementation will help the PI to obtain his habilitation degree.