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3D PCB package for GaN inverter leg with low EMC feature

Abstract

This paper presents the adaptation of a 3D integration concept previously used with vertical devices to lateral GaN devices. This 3D integration allows to reduce loop inductance, to ensure more symmetrical design with especially limited Common Mode emission, thanks to a low middle point stray capacitance. This reduction has been achieved by both working on the power layout and including a specific shield between the devices and the heatsink. The performances of this 3D layout have been verified in comparison with a more conventional 2D implementation, using both simulations and measurements.

Details

Category:
Conference activity
Type:
publikacja w wydawnictwie zbiorowym recenzowanym (także w materiałach konferencyjnych)
Language:
English
Publication year:
2020
Bibliographic description:
Derkacz P., Chrzan P., Jeannin P., Musznicki P., Petit M., Schanen J.: 3D PCB package for GaN inverter leg with low EMC feature// / : , 2020,
Verified by:
Gdańsk University of Technology

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