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Microstructure and Electrical Properties of Fe,Cu Substituted (Co,Mn)3O4 Thin Films

Abstract

In this work, thin films (~1000 nm) of a pure MnCo2O4 spinel together with its partially substituted derivatives (MnCo1.6Cu0.2Fe0.2O4, MnCo1.6Cu0.4O4, MnCo1.6Fe0.4O4) were prepared by spray pyrolysis and were evaluated for electrical conductivity. Doping by Cu increases the electrical conductivity, whereas doping by Fe decreases the conductivity. For Cu containing samples, rapid grain growth occurs and these samples develop cracks due to a potentially too high thermal expansion coefficient mismatch to the support. Samples doped with both Cu and Fe show high electrical conductivity, normal grain growth and no cracks. By co-doping the Mn, Co spinel with both Cu and Fe, its properties can be tailored to reach a desired thermal expansion coefficient/electrical conductivity value.

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Authors (4)

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Details

Category:
Articles
Type:
artykuł w czasopiśmie wyróżnionym w JCR
Published in:
Crystals no. 7, edition 7,
ISSN: 2073-4352
Language:
English
Publication year:
2017
Bibliographic description:
Grudzień D., Molin S., Hendriksen P. V., Jasiński P.: Microstructure and Electrical Properties of Fe,Cu Substituted (Co,Mn)3O4 Thin Films// Crystals. -Vol. 7, iss. 7 (2017), s.185-
DOI:
Digital Object Identifier (open in new tab) 10.3390/cryst7070185
Sources of funding:
  • COST_FREE
Verified by:
Gdańsk University of Technology

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