Highly-Miniaturized Self-Quadruplexing Antenna Based on Substrate-Integrated Rectangular Cavity

Rusan Kumar Barik; Sławomir Kozieł

doi:10.1109/lawp.2022.3216305

Highly-Miniaturized Self-Quadruplexing Antenna Based on Substrate-Integrated Rectangular Cavity

Abstrakt

This paper introduces a novel self-quadruplexing antenna (SQA) architecture using a substrate-integrated rectangular cavity (SIRC) for compact size, wide-frequency re-designability, and high isolation responses. The proposed SQA is developed by engraving two U-shaped slots (USSs) on the top conductor of the SIRC. The USSs are excited by employing four microstrip feedlines to achieve self-quadruplexing antenna characteristics. The operating frequencies can be tuned independently according to the assumed targets, with a wide tuning range from 2.3 GHz to 7 GHz. The dimensions of USSs are meticulously chosen to achieve high isolation and compact size. An equivalent circuit is suggested to validate the proposed SQA. Finally, the SQA operating at 2.33, 2.96, 5.43, and 6.15 GHz is fabricated and validated. As compared to the earlier SQAs, the proposed antenna offers competitive performance with a compact size of 0.124λ2 (45.6% smaller than the most compact SQA reported in the literature), high isolation of 32.5 dB, and a wide tunable range from 2.3 GHz to 7 GHz. Its measured gain is 4.31, 3.39, 6.12, and 4.34dBi at 2.33, 2.96, 5.43, and 6.15 GHz, respectively.

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Autorzy (2)

Rusan Kumar Barik
Sławomir Kozieł prof. dr inż.

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Słowa kluczowe

SUBSTRATE INTEGRATED RECTANGULAR CAVITY, SELF-QUADRUPLEXING ANTENNA, U-SHAPED SLOT, WIDE TUNABLE

Informacje szczegółowe

Kategoria:

Publikacja w czasopiśmie

Typ:

artykuły w czasopismach

Opublikowano w:

IEEE Antennas and Wireless Propagation Letters nr 22, strony 482 - 486,
ISSN: 1536-1225

Język:

angielski

Rok wydania:

2023

Opis bibliograficzny:

Barik R. K., Kozieł S.: Highly-Miniaturized Self-Quadruplexing Antenna Based on Substrate-Integrated Rectangular Cavity// IEEE Antennas and Wireless Propagation Letters -Vol. 22,iss. 3 (2023), s.482-486

DOI: