Method of Monitoring of the Grinding Process with Lapping Kinematics Using Audible Sound Analysis - Publikacja - MOST Wiedzy

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Method of Monitoring of the Grinding Process with Lapping Kinematics Using Audible Sound Analysis

Abstrakt

Utilising microphones as audible sound sensors for monitoring a single-side grinding process with lapping kinematics is presented in the paper. The audible sound generated during grinding depended on the cutting properties of electroplated tools with D107 diamond grains and different thicknesses of the nickel bond. The tool wear affected the obtained technological effects such as material removal rate and the surface roughness of Al2O3 ceramic samples. The relationship between the quantities that characterise the sound signal and the surface roughness of machined surfaces was examined with the use of spectral analysis of the sound signal in the frequency domain with a focus on the Ra parameter. The decreasing amplitude indicated a better surface finish, down to Ra = 0.23 µm. The developed method and the obtained results will facilitate the practical use of the electroplated tools in the lap-grinding technology without interrupting the process before obtaining the required surface roughness.

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Informacje szczegółowe

Kategoria:
Publikacja w czasopiśmie
Typ:
artykuły w czasopismach
Opublikowano w:
Journal of Machine Engineering nr 22, strony 5 - 15,
ISSN: 1895-7595
Język:
angielski
Rok wydania:
2022
Opis bibliograficzny:
Deja M.: Method of Monitoring of the Grinding Process with Lapping Kinematics Using Audible Sound Analysis// Journal of Machine Engineering -Vol. 22,iss. 4 (2022), s.5-15
DOI:
Cyfrowy identyfikator dokumentu elektronicznego (otwiera się w nowej karcie) 10.36897/jme/157255
Źródła finansowania:
  • Działalność statutowa/subwencja
Weryfikacja:
Politechnika Gdańska

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