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Monitoring the curing process of epoxy adhesive using ultrasound and Lamb wave dispersion curves

Abstrakt

Monitoring the stiffness of adhesives is a crucial issue when considering the durability andstrength of adhesive joints. While there are many studies conducted on specimens madeonly from adhesive, the problem of curing of an adhesive film in real joints is moderatelyconsidered. This paper presents the monitoring of stiffening of epoxy adhesive using ultra-sound. Ultrasonic pulse velocity method was firstly applied for monitoring of adhesivespecimens. Then, a new procedure using dispersion relations and scanning laser vibrome-try was proposed for monitoring the curing process of an adhesive joint of steel plates. Bothapproaches gave comparable results showing the increase of the dynamic elastic modulusof adhesive in time. The study presented that the proposed procedure was capable of real-time monitoring the curing process of an adhesive layer in multi-layer systems.

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Informacje szczegółowe

Kategoria:
Publikacja w czasopiśmie
Typ:
artykuły w czasopismach
Opublikowano w:
MECHANICAL SYSTEMS AND SIGNAL PROCESSING nr 151, strony 1 - 13,
ISSN: 0888-3270
Język:
angielski
Rok wydania:
2021
Opis bibliograficzny:
Wojtczak E., Rucka M.: Monitoring the curing process of epoxy adhesive using ultrasound and Lamb wave dispersion curves// MECHANICAL SYSTEMS AND SIGNAL PROCESSING -Vol. 151, (2021), s.1-13
DOI:
Cyfrowy identyfikator dokumentu elektronicznego (otwiera się w nowej karcie) 10.1016/j.ymssp.2020.107397
Weryfikacja:
Politechnika Gdańska

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