A random field-based simulational identification of possible levels of material imperfections of adhesive-bonded joints - Publication - Bridge of Knowledge

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A random field-based simulational identification of possible levels of material imperfections of adhesive-bonded joints

Abstract

Recently, structural adhesives have become significant in the shaping of structural elements, especially in thin-walled structures, where they replace or supplement traditional connection methods. However, adhesive-bonded joints are highly susceptible to internal structural imperfections due to their application technique and the nature of the adhesive. These material inconsistencies impact the strength parameters and the mechanical behavior of the entire connection. This study proposes a simplified method for the probabilistic numerical modeling of structural imperfections in an adhesive layer. The adhesive is modeled as an uncorrelated random field with weakened elements representing structural imperfections randomly scattered throughout its entire volume. The percentage of these imperfections (in relation to the total volume) is adopted a random variable.By conducting experimental tests on dogbone specimens of a selected adhesive and comparing them to adequate numerical tests with varying volumes of weakened elements, the determination of the representative imperfection volume of the investigated adhesive was possible. Based on these tests, the calibration of the probability density function to describe the volume of the imperfections may be performed. Furthermore, the application of the random model for an adhesive-bonded single lap-joint is shown to be viable. Finally, the calculation of a probability-based mechanical response (in this case, the normal force at critical elongation) of the single lap-joint with structural imperfections is performed, and its resultant reliability is assessed and evaluated.

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Category:
Articles
Type:
artykuły w czasopismach dostępnych w wersji elektronicznej [także online]
Published in:
Bulletin of the Polish Academy of Sciences-Technical Sciences pages 1 - 12,
ISSN: 0239-7528
Language:
English
Publication year:
2024
Bibliographic description:
Winkelmann K., Jan F., Smakosz Ł., Konopińska-Zmysłowska V., Eremeyev V., Kujawa M., A random field-based simulational identification of possible levels of material imperfections of adhesive-bonded joints, Bulletin of the Polish Academy of Sciences-Technical Sciences, 2024,10.24425/bpasts.2024.151678
DOI:
Digital Object Identifier (open in new tab) 10.24425/bpasts.2024.151678
Sources of funding:
  • IDUB
Verified by:
Gdańsk University of Technology

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