Ag-based Thermal Interface Materials for GaN-on-Si Assembly Chips in Power Applications - Publication - Bridge of Knowledge

Ag-based Thermal Interface Materials for GaN-on-Si Assembly Chips in Power Applications

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Authors (3)

Ryszard Kisiel
Piotr Spiewak
Miroslaw Kruszewski

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Publication year:: 2021
DOI:: Digital Object Identifier (open in new tab) 10.1109/isse51996.2021.9467637
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