Modeling the debonding process of osseointegrated implants due to coupled adhesion and friction - Publication - Bridge of Knowledge

Search

Modeling the debonding process of osseointegrated implants due to coupled adhesion and friction

Abstract

Cementless implants have become widely used for total hip replacement surgery. The long-term stability of these implants is achieved by bone growing around and into the rough surface of the implant, a process called osseointegration. However, debonding of the bone–implant interface can still occur due to aseptic implant loosening and insufficient osseointegration, which may have dramatic consequences. The aim of this work is to describe a new 3D finite element frictional contact formulation for the debonding of partially osseointegrated implants. The contact model is based on a modified Coulomb friction law by Immel et al. (2020), that takes into account the tangential debonding of the bone-implant interface. This model is extended in the direction normal to the bone-implant interface by considering a cohesive zone model, to account for adhesion phenomena in the normal direction and for adhesive friction of partially bonded interfaces. The model is applied to simulate the debonding of an acetabular cup implant. The influence of partial osseointegration and adhesive effects on the long-term stability of the implant is assessed. The influence of different patient- and implant-specific parameters such as the friction coefficient mu_b , the trabecular Young’s modulus E_b , and the interference fit IF is also analyzed, in order to determinethe optimal stability for different configurations. Furthermore, this work provides guidelines for future experimental and computational studies that are necessary for further parameter calibration.

Citations

  • 4

    CrossRef

  • 0

    Web of Science

  • 4

    Scopus

Authors (4)

Keywords

Details

Category:
Articles
Type:
artykuły w czasopismach
Published in:
Biomechanics and Modeling in Mechanobiology no. 22, pages 133 - 158,
ISSN: 1617-7959
Language:
English
Publication year:
2023
Bibliographic description:
Immel K., Nguyen V., Haiat G., Sauer R.: Modeling the debonding process of osseointegrated implants due to coupled adhesion and friction// Biomechanics and Modeling in Mechanobiology -,iss. 1 (2023), s.133-158
DOI:
Digital Object Identifier (open in new tab) 10.1007/s10237-022-01637-7
Sources of funding:
  • Free publication
Verified by:
Gdańsk University of Technology

seen 67 times

Recommended for you

Meta Tags