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Abstract
Monitoring the stiffness of adhesives is a crucial issue when considering the durability andstrength of adhesive joints. While there are many studies conducted on specimens madeonly from adhesive, the problem of curing of an adhesive film in real joints is moderatelyconsidered. This paper presents the monitoring of stiffening of epoxy adhesive using ultra-sound. Ultrasonic pulse velocity method was firstly applied for monitoring of adhesivespecimens. Then, a new procedure using dispersion relations and scanning laser vibrome-try was proposed for monitoring the curing process of an adhesive joint of steel plates. Bothapproaches gave comparable results showing the increase of the dynamic elastic modulusof adhesive in time. The study presented that the proposed procedure was capable of real-time monitoring the curing process of an adhesive layer in multi-layer systems.
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Full text
- Publication version
- Accepted or Published Version
- DOI:
- Digital Object Identifier (open in new tab) 10.1016/j.ymssp.2020.107397
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- Category:
- Articles
- Type:
- artykuły w czasopismach
- Published in:
-
MECHANICAL SYSTEMS AND SIGNAL PROCESSING
no. 151,
pages 1 - 13,
ISSN: 0888-3270 - Language:
- English
- Publication year:
- 2021
- Bibliographic description:
- Wojtczak E., Rucka M.: Monitoring the curing process of epoxy adhesive using ultrasound and Lamb wave dispersion curves// MECHANICAL SYSTEMS AND SIGNAL PROCESSING -Vol. 151, (2021), s.1-13
- DOI:
- Digital Object Identifier (open in new tab) 10.1016/j.ymssp.2020.107397
- Verified by:
- Gdańsk University of Technology
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