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ISSN:
0892-7022
eISSN:
1029-0435
Disciplines
(Field of Science):
- automation, electronics, electrical engineering and space technologies (Engineering and Technology)
- biomedical engineering (Engineering and Technology)
- chemical engineering (Engineering and Technology)
- materials engineering (Engineering and Technology)
- mechanical engineering (Engineering and Technology)
- medical biology (Medical and Health Sciences )
- pharmacology and pharmacy (Medical and Health Sciences )
- agriculture and horticulture (Agricultural sciences)
- biotechnology (Natural sciences)
- chemical sciences (Natural sciences)
- physical sciences (Natural sciences)
(Field of Science)
Ministry points: Help
| Year | Points | List |
|---|---|---|
| Year 2024 | 70 | Ministry scored journals list 2024 |
| Year | Points | List |
|---|---|---|
| 2024 | 70 | Ministry scored journals list 2024 |
| 2023 | 70 | Ministry Scored Journals List |
| 2022 | 70 | Ministry Scored Journals List 2019-2022 |
| 2021 | 70 | Ministry Scored Journals List 2019-2022 |
| 2020 | 70 | Ministry Scored Journals List 2019-2022 |
| 2019 | 70 | Ministry Scored Journals List 2019-2022 |
| 2018 | 15 | A |
| 2017 | 15 | A |
| 2016 | 15 | A |
| 2015 | 15 | A |
| 2014 | 15 | A |
| 2013 | 15 | A |
| 2012 | 20 | A |
| 2011 | 20 | A |
| 2010 | 20 | A |
Model:
Hybrid
Points CiteScore:
| Year | Points |
|---|---|
| Year 2022 | 3.9 |
| Year | Points |
|---|---|
| 2022 | 3.9 |
| 2021 | 3.7 |
| 2020 | 3.2 |
| 2019 | 3.3 |
| 2018 | 2.8 |
| 2017 | 2.6 |
| 2016 | 2.6 |
| 2015 | 2.2 |
| 2014 | 2.1 |
| 2013 | 2 |
| 2012 | 2.1 |
| 2011 | 2.2 |
Impact Factor:
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Sherpa Romeo:
Papers published in journal
Filters
total: 1
Catalog Journals
Year 2021
-
Effect of heat treatment on the diffusion intermixing and structure of the Cu thin film on Si (111) substrate: a molecular dynamics simulation study
PublicationThis work is devoted to the study of the diffusion process at the interface between copper films with a thickness of 2, 3, 4, 7 and 10 atomic monolayers and silicon substrate by molecular dynamics simulation method. For this purpose, the variation of the concentration of copper and silicon along the perpendicular direction to the interface was investigated. An analysis of the density profile along this direction made it possible...
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