
Adiunkt Mirosław Kruszewski
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Publication showcase
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Diamond–tungsten based coating–copper composites with high thermal conductivity produced by Pulse Plasma Sintering
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Design of interfacial Cr3C2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications
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Interfacial microstructure of copper/diamond composites fabricated via a powder metallurgical route
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