Description
Ultra-thin layers of Al2O3 were deposited by atomic layer deposition (ALD) (Beneq TFS 200 ALD system). This method provides precise thickness control down to a single atomic layer. The precursors used were trimethylaluminum (Sigma-Aldrich) and purified water. The deposition of the atomic layer was carried out at 200 °C. Samples with a thickness of 2 and 8 nm of alumina, deposited on silicon (111) substrates, were selected for the tests. A Philips X'Pert diffractometer system with Cu filtered Kα radiation in the range 10° – 80° of 2θ was used for XRD measurements. No crystalline phase was bserved in prepared samples.
Dataset file
Al2O3.zip
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File details
- License:
-
open in new tabCC BYAttribution
- Raw data:
- Data contained in dataset was not processed.
- Software:
- origin
Details
- Year of publication:
- 2021
- Verification date:
- 2021-07-14
- Creation date:
- 2019
- Dataset language:
- English
- Fields of science:
-
- materials engineering (Engineering and Technology)
- DOI:
- DOI ID 10.34808/gb2e-eh30 open in new tab
- Verified by:
- Gdańsk University of Technology
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