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Building the fully European supplY chain on RFSOI, enabling New RF Domains for Sensing, Communication, 5G and beyond
BEYOND5 is first and foremost a technology project gathering most significant European actors covering the entire value chain from materials, semiconductor technologies, designs and components up to the systems. BEYOND5 will drive industrial roadmaps in More than Moore (MtM) in adding connectivity features on existing CMOS Technology. The ambition is to accomplish sustainable Radio Frequency SOI platforms to cover the frequency range from 0.7GHz to more than 100GHz, and to demonstrate the technical advantage of SOI, which allows combining large scale integration, low power consumption, cost competitiveness and higher reliability; thus, resulting in high volume production of trusted components with low environmental impact in Europe.
Participation BEYOND5 consortium brings GUT a unique opportunity to develop smart/reconfigurable antenna solutions that can be successfully applied in practical real-world scenarios and, thanks to “package-on-package” approach, will enable wider applicability of mm-Wave SIP solutions. Additionally, GUT will verify how additive manufacturing concept may be used in 5G solutions for easy adaptation of generic IC to different application domains. Hence, GUT’s R&D activities will be better focused on the most important areas from the business point of view and all the work will be performed in an efficient way. In consequence, this will result in more valuable publications and will influence educational activities.
Details
- Project's acronym:
- BEYOND5
- Financial Program Name:
- HORIZON 2020
- Organization:
- Komisja Europejska
- Agreement:
- 876124 z dnia 2020-05-28
- Realisation period:
- 2021-03-08 - 2024-05-31
- Research team leader:
- dr hab. inż. Krzysztof Nyka
- Realised in:
- Department of Microwave and Antenna Engineering
- External institutions
participating in project: -
- SEQUANS COMMUNICATIONS SA (France)
- Arbe Robotics Ltd. (Israel)
- STMICROELECTRONICS GRENOBLE 2 SAS (France)
- SILICON RADAR GMBH (Germany)
- INSTITUT POLYTECHNIQUE DE BORDEAUX (France)
- ASYGN (France)
- UNIVERSITATEA POLITEHNICA DIN BUCURESTI (Romania)
- MUNEDA GMBH (Germany)
- ERICSSON AB (Sweden)
- TRAXENS (France)
- MARMARA UNIVERSITY (Turkey)
- MIKROELEKTRONIK ARASTIRMA GELISTIRME TASARIM VE TICARET LIMITED SIRKETI (Turkey)
- KUNGLIGA TEKNISKA HOEGSKOLAN (Sweden)
- TURKCELL TEKNOLOJI ARASTIRMA VE GELISTIRME ANONIM SIRKETI (Turkey)
- STMICROELECTRONICS CROLLES 2 SAS (France)
- FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (Germany)
- TURKIYE BILIMSEL VE TEKNOLOJIK ARASTIRMA KURUMU (Turkey)
- LUNDS UNIVERSITET (Sweden)
- SONY DEUTSCHLAND GMBH (Germany)
- TECHNISCHE UNIVERSITAET DRESDEN (Germany)
- TECHNISCHE UNIVERSITEIT DELFT (Netherlands)
- ADC AUTOMOTIVE DISTANCE CONTROL SYSTEMS GMBH (Germany)
- SMART IS MAKINALARI SANAYI VE TICARET A.S (Turkey)
- UNIVERSITE CATHOLIQUE DE LOUVAIN (Belgium)
- NATIONAL INSTRUMENTS DRESDEN GMBH (Germany)
- INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM (Belgium)
- HOCHSCHULE FUR ANGEWANDTE WISSENSCHAFTEN HAMBURG (Germany)
- ROGERS BVBA (Belgium)
- CADENCE DESIGN SYSTEMS GMBH (Germany)
- FLAVIA IT-Management GmbH (Germany)
- SOITEC SA (France)
- FORD OTOMOTIV SANAYI ANONIM SIRKETI (Turkey)
- AED ENGINEERING GMBH (Germany)
- ANTEVERTA-MW BV (Netherlands)
- SILTRONIC AG (Germany)
- GLOBALFOUNDRIES Dresden Module One LLC & Co. KG (Germany)
- UNIVERSITAET DER BUNDESWEHR MUENCHEN (Germany)
- COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (France)
- RFbeam Microwave GmbH (Switzerland)
- Project's value:
- 96 138 122.63 EUR
- Request type:
- International Research Programmes
- Domestic:
- International project
- Verified by:
- Gdańsk University of Technology
Papers associated with that project
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Catalog Projects
Year 2024
-
Low-Cost 3-D Printed Lens Antenna for Ka-Band Connectivity Applications
PublicationThis paper discusses the use of low-cost 3-D printing technology to fabricate dielectric lenses for Ka-band wireless networks. A low-cost FDM alternative to previously presented 3-D printed lens in SLA technology with high performance resin is presented. The presented approach has been demonstrated for a 39 GHz MU-MIMO antenna array modified to realize multibeam or switched-beam antenna that can support demanding energy-efficient...
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