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Abstract
The focus of this review is to present the current advances in Loop Heat Pipes (LHP) with flat evaporators, which address the current challenges to the wide implementation of the technology. A recent advance in LHP is the design of flat-shaped evaporators, which is better suited to the geometry of discretely mounted electronics components (microprocessors) and therefore negate the need for an additional transfer surface (saddle) between component and evaporator. However, various challenges exist in the implementation of flat-evaporator, including (1) deformation of the evaporator due to high internal pressure and uneven stress distribution in the non-circular casing; (2) heat leak from evaporator heating zone and sidewall into the compensation chamber; (3) poor performance at start-up; (4) reverse flow through the wick; or (5) difficulties in sealing, and hence frequent leakage. This paper presents and reviews state-of-the-art LHP technologies; this includes an (a) review of novel manufacturing methods; (b) LHP evaporator designs; (c) working fluids; and (d) construction materials. The work presents solutions that are used to develop or improve the LHP construction, overall thermal performance, heat transfer distance, start-up time (especially at low heat loads), manufacturing cost, weight, possibilities of miniaturization and how they affect the solution on the above-presented problems and challenges in flat shape LHP development to take advantage in the passive cooling systems for electronic devices in multiple applications.
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Authors (4)
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Richard Law dr
- School of Engineering, Newcastle University, Newcastle Upon Tyne, NE1 7RU, UK
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Ryan Mc Glen (formerly: Ryan McGlen) dr
- Aavid, Thermal Division of Boyd Corporation, Ashington, NE63 8QW, UK
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David Reay prof.
- School of Engineering, Newcastle University, Newcastle Upon Tyne, NE1 7RU, UK
Cite as
Full text
- Publication version
- Accepted or Published Version
- DOI:
- Digital Object Identifier (open in new tab) 10.3390/e23111374
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Keywords
Details
- Category:
- Articles
- Type:
- artykuły w czasopismach
- Published in:
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ENTROPY
no. 23,
ISSN: 1099-4300 - Language:
- English
- Publication year:
- 2021
- Bibliographic description:
- Szymański P., Law R., Mcglen R., Reay D.: Recent Advances in Loop Heat Pipes with Flat Evaporator// ENTROPY -Vol. 23,iss. 11 (2021), s.1374-
- DOI:
- Digital Object Identifier (open in new tab) 10.3390/e23111374
- Sources of funding:
-
- Statutory activity/subsidy
- Verified by:
- Gdańsk University of Technology
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