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Reduced-cost optimization-based miniaturization of microwave passives by multi-resolution EM simulations for internet of things and space-limited applications

Abstract

Stringent performance specifications along with constraints imposed on physical dimensions, make the design of contemporary microwave components a truly onerous task. In recent years, the latter demand has been growing in importance, with the innovative application areas such as Internet of Things coming into play. The need to employ full-wave electromagnetic (EM) simu-lations for response evaluation, reliable yet CPU heavy, only aggravates the issue. This paper proposes a reduced-cost miniaturization algorithm that employs trust-region search procedure and multi-resolution EM simulations. In our approach, the resolution of the EM model is ad-justed throughout the optimization process based on its convergence status starting from the lowest admissible fidelity. As the algorithm converges, the resolution is increased up to the high-fidelity one, used at the final phase to ensure reliability. Four microwave components have been utilized as verification structures: an impedance matching transformer, and three branch-line couplers. Significant savings in terms of the number of EM analyses required to con-clude the size reduction process of 41, 42, 38 and 50 percent have been obtained (in comparison to a single-fidelity procedure). The footprint area of the designs optimized using the pro-posed approach are equal to: 32, 205, 410 and 132 mm2, in comparison to 52, 275, 525, and 213 mm2 of the initial (and already compact) design.

Citations

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Keywords

Details

Category:
Articles
Type:
artykuły w czasopismach
Published in:
Electronics no. 11,
ISSN: 2079-9292
Language:
English
Publication year:
2022
Bibliographic description:
Pietrenko-Dąbrowska A., Kozieł S., Raef A.: Reduced-cost optimization-based miniaturization of microwave passives by multi-resolution EM simulations for internet of things and space-limited applications// Electronics -Vol. 10,iss. 24 (2022), s.1-14
DOI:
Digital Object Identifier (open in new tab) 10.3390/electronics11244094
Sources of funding:
  • Free publication
Verified by:
Gdańsk University of Technology

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