Search results for: MICROSTRUCTURE DEFECTS
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Search results for: MICROSTRUCTURE DEFECTS
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AFM imaging of surface of modern soldering alloy
Open Research DataFollowing the announcement in 2006 of European Union directives aimed at limiting the use of lead in electronic products, there was an urgent need to use lead-free solders in the electronics industry. Due to production requirements, it is necessary to use solders with different melting points. To replace the low-melting eutectic Sn 37 wt. Pb, the most...