Description
The surface of a fragment of the structure of an integrated circuit. Topographic measurements in the semi-contact mode. NTEGRA Prima (NT-MDT) device. NSG 01 probe.
The quality of production of the elements forming the structure of the integrated circuit is crucial for the further development and miniaturization of modern electronic equipment. Atomic force microscopy can be used as one of the techniques for monitoring the accuracy of microcircuit fabrication. It allows, for example, the detection of factory defects consisting in the shortening of the paths, or the assessment of their width and mutual position, determining the size of the parasitic effects. The data provided clearly indicate a sufficient resolution of the imaging variant used. Visible defects in the structure of the imaged elements result from the fact that they were not obtained from the production line, but by destructive disassembly of the commercial processors. The file contains 12 images.
Dataset file
hexmd5(md5(part1)+md5(part2)+...)-{parts_count}
where a single part of the file is 512 MB in size.Example script for calculation:
https://github.com/antespi/s3md5
File details
- License:
-
open in new tabCC BY-NCNon-commercial
- Software:
- Gwyddion
Details
- Year of publication:
- 2021
- Verification date:
- 2021-04-29
- Dataset language:
- English
- Fields of science:
-
- chemical sciences (Natural sciences)
- DOI:
- DOI ID 10.34808/eyx5-5f67 open in new tab
- Series:
- Verified by:
- Gdańsk University of Technology
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