Gold nanocubic structures agglomeration when put on conductive surfaces - Open Research Data - Bridge of Knowledge

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Gold nanocubic structures agglomeration when put on conductive surfaces

Description

This dataset contains SEM images of gold nanocubes (AuNC), which were deposited at the conductive Si wafer surface and dried. The deposition method, the solvent used and AuNC concentration have a significant influence on the homogeneous distribution and their agglomeration at the surface, further influencing the electrochemical characteristics of the electrodes operating with their use.  

The surfactant used was CTAB. The images are characterized with different surfactant concentration in the solvent: sample 5 - 1mM CTAB, 6 - 0.1 mM CTAB, 7 - 0.01 mM CTAB, 8 - 0.001 mM CTAB. The amount of used AuNC was 10 uL in each case. The volume of the solvent deposited at the surface was 1 mL. Label (A) means that sample was additionally washed with deionized water.

The topography analysis was investigated by scanning electron microscopy (FEI Quanta FEG 250) with an Everhart–Thornley secondary electron detector at an acceleration voltage of 20 kV.  

Dataset file

AuNC_set2.zip
294.6 MB, S3 ETag b2ed0f6e936baa9b240b80985b230fac-1, downloads: 5
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restricted until published
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Details

Year of publication:
2021
Verification date:
2021-08-06
Dataset language:
English
Fields of science:
  • chemical sciences (Natural sciences)
  • materials engineering (Engineering and Technology)
DOI:
DOI ID 10.34808/sr0r-8107 open in new tab
Funding:
Series:
Verified by:
Gdańsk University of Technology

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