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Boron doped Nanocrystalline Diamond-Carbon Nanospike Hybrid Electron Emission Source

Abstract

Electron emission signifies an important mechanism facilitating the enlargement of devices that have modernized large parts of science and technology. Today, the search for innovative electron emission devices for imaging, sensing, electronics, and high-energy physics continues. Integrating two materials with dissimilar electronic properties into a hybrid material is an extremely sought-after synergistic approach envisioning a superior field electron emission (FEE) material. An innovation is described regarding the fabrication of a nanostructured carbon hybrid resulting from the one-step growth of boron doped nanocrystalline diamond (BNCD) and carbon nanospikes (CNSs) by a microwave plasma enhanced chemical vapor deposition technique. Spectroscopic and microscopic tools are used to investigate the morphological, bonding, and microstructural characteristics related to the growth mechanism of these hybrids. Utilizing the benefits of both the sharp edges of the CNSs and the high stability of BNCD, a promising FEE performance with a lower turn-on field of 1.3 V um-1, a higher field enhancement factor of 6780, and a stable FEE current stability lasting for 780 min is obtained. The microplasma devices utilizing these hybrids as a cathode illustrate a superior plasma illumination behavior. Such hybrid carbon nanostructures, with superb electron emission characteristics, can encourage the enlargement of several electron emission device technologies.

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Copyright (2019 American Chemical Society)

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Category:
Articles
Type:
artykuły w czasopismach
Published in:
ACS Applied Materials & Interfaces no. 11, pages 48612 - 48623,
ISSN: 1944-8244
Language:
English
Publication year:
2019
Bibliographic description:
Kamatchi S., Ficek M., Kalpataru P., Yeh C., Mirosław S., Ryl J., Leou K., Young Park J., Lin I., Bogdanowicz R., Haenen K.: Boron doped Nanocrystalline Diamond-Carbon Nanospike Hybrid Electron Emission Source// ACS Applied Materials & Interfaces -Vol. 11,iss. 51 (2019), s.48612-48623
DOI:
Digital Object Identifier (open in new tab) 10.1021/acsami.9b17942
Sources of funding:
Verified by:
Gdańsk University of Technology

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