The Idea of Using Adhesive Bonds in Shaping of Cold-formed Thin-walled Beam-columns - Publikacja - MOST Wiedzy

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The Idea of Using Adhesive Bonds in Shaping of Cold-formed Thin-walled Beam-columns

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The chapter concerns the idea of using adhesive bonds in the shaping of cold-formed thin-walled beam-columns. The idea of adhesive-bonded connections is not new but is unlikely to have been used in the design and shaping of thin-walled beam-columns in civil engineering up to date. Metal bar structures, including (due to economic reasons) thin-walled structures, are the most common and effective means to build engineering superstructures/loadbearing structures. Over the years, classical techniques of connection between individual structural elements, such as bolting or welding, have mainly been used. However, the classical types of connections have their disadvantages, eliminable by using less conventional solutions, e.g. the adhesive-bonded connections. The use of structural adhesives in engineering, particularly in metal construction design, unfortunately still raises questions about their durability and load-bearing capacity. An important issue in the case of bonded structures is the effect of creep on the behavior of such joints. These issues undoubtedly require further research in the context of bonded joints. The topic still needs fundamental research of empirical and theoretical nature that will contribute to the acquisition of new knowledge on the mechanical phenomena occurring in adhesively bonded metal structures. The authors also expect that in the long run, the idea will be widely used in modern-day civil engineering.

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Kategoria:
Publikacja monograficzna
Typ:
rozdział, artykuł w książce - dziele zbiorowym /podręczniku o zasięgu krajowym
Język:
angielski
Rok wydania:
2023
Opis bibliograficzny:
Kujawa M., Cazzani A., Smakosz Ł., Konopińska-Zmysłowska V., Winkelmann K., Jan F., Szymczak C.: The Idea of Using Adhesive Bonds in Shaping of Cold-formed Thin-walled Beam-columns// Sixty Shades of Generalized Continua/ : , 2023, s.333-344
DOI:
Cyfrowy identyfikator dokumentu elektronicznego (otwiera się w nowej karcie) 10.1007/978-3-031-26186-2_28
Źródła finansowania:
  • Publikacja bezkosztowa
Weryfikacja:
Politechnika Gdańska

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